The machine comes with a 2 position slide table for die presentation and heated work holder. Click the links under the Product Type column head to see other like items of that type. The Esec 2100 hS is the first model of the 2100 Die Bonder. The Next Generation High Speed Die Bonder. Standard Configuration Die Bonder 2008 The fully programmable Die Bonding system for High End Packages Esec 2100. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate The Die Bonder Esec 2100 xPplus is the the 2ndgeneration of the most The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach Besi’sTM die attach equipment is based on unique and innovative concepts, offering economical benefits to customers.
630 employees within its global footprint. Leader in epoxy and soft solder die bonders, one of the top providers of wire bonders and flip chip bonders.
esec 2100 die bonder manual, esec 2008 die bonder manual, esec die bonder manual, esec die bonder manuale, esec die bonder manual pdf, esec die bonder manual instructions, esec die bonder manual download.Īdvanced soft- Soft-solder technologies in use with ESEC A-PLF die attach systems.It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
We sell our equipment at a fair price, and offer quality technical support, service, spare parts and warranties customers normally expect from Original Equipment Manufacturers (OEMs). We buy and refurbish surplus bonders, inspection systems, dicing systems, testers and more. We stand behind what we sell and will do our best to take the stress out of your purchase. First class service staff - all full time employees not contractors are seasoned industry professionals who will not only help you get your project off the ground, but will keep you running for years to come. Back to login Login here Our chief differentiator is our people. Key Features Specifications Options Downloads. At its introduction, this innovative platform concept won the prestigious Swiss Technology Award. PDF, ePub, eBook, fb2, mobi, txt, doc, rtf, djvu ▶▷▶▷ esec die bonder manual esec die bonder manual File Name: